Innovation and Technology Commision Support Programme 2026 (With Funding Available)

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About Innovation and Technology Commision Support Programme

The Innovation and Technology Support Programme (ITSP) supports applied R&D projects in Hong Kong that promote innovation and technology transfer to local industries.

Benefits of Innovation and Technology Commision Support Programme

• Funding limits:
  • Up to HK$2.8 million (R&D Centres)
  • Up to HK$1.4 million (other eligible applicants)

Innovation and Technology Commision Support Programme Requirements

For Platform and Seed Projects

Eligible applicants include:

• R&D Centres in Hong Kong

• Designated local public research institutes

For Collaborative Projects

Eligible structure:

• Lead applicant: R&D Centre or designated public research institute

• Co-applicant: Industry partner, such as:

  • Hong Kong-incorporated companies

  • Industry support organisations

  • Trade and industry associations

  • Professional bodies with legal contracting capacity

Application Date and Process

• Click on the link to the application website to apply.

Application Deadline

17 July, 2026

Opportunity Application

View details of Innovation and Technology Commision Support Programme

Apply for Innovation and Technology Commision Support Programme